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Objective of the TIES Summer Leadership Scholarship/Internship
Exceptional engineering leaders will conduct in-depth research in particular areas of the TIES project they have been associated with, further their leadership training, and continue the relationship between TIES and the non-profit client.
Congratulations to the 2007 TIES summer interns!
The requirements of the internship are:
- Students must be associated with an existing TIES project during the 06-07 academic year to be considered for the internship.
- Students must be able to continue on the same TIES project for the Fall 2007 quarter in a leadership role (team lead, subteam lead or TA).
The components of the internship are:- Each internship will be 10 weeks, and will pay $2500 to each student. We hope to have a diverse group of students each year.
- Approximately 20 hours/week.
- Student-client budget of $500 per team.
- Communication with the Community Client must be maintained, respected, and fostered throughout the entire summer internship.
- Design reviews will be conducted with TIES faculty advisors on a weekly basis.
- Leadership internship workshops - to discuss professional development, social awareness, project management, and ethics:
- TIES summer internship orientation and first leadership training session
July 2, 2007
4:00 pm - 6:30 pm
Agenda:
1) Sign paperwork (you will need to bring your drivers license and (SS card OR and passport) for your 2 forms of ID)
2) Have pizza for diner
3) Go over summer timeline, deliverables, and final presentations
4) First leadership training
- Mid-summer leadership training
date and time TBA
- Deliverables (all documents turned into faculty advisor and TIES director):
- Summer budget - estimate cost of research
- Summer goals with approximate timeline
- Written continuity report - deadline will be discussed with the faculty advisor
- Final Oral presentation - first week of September, exact date and time TBA
Spotlight on one of the 2006 TIES summer intern:
Fabiola Hatley, a Chemical Engineering major and former Vice President of the Society of Hispanic Professional Engineers at UCSD, said that “Upon joining TIES, my professional growth was accelerated. I have been able to exercise my team-building, leadership, and communication skills in a way that no other class has been able to match. The opportunities and benefits of joining TIES do not stop there. They go way beyond these professional areas. The networking among the team members, client, advisors, and industry is priceless and rewarding. Doors opened for me to new worlds, drastically changing my professional skills and private life. This could happen for others too!” Fabiola continued the circle, and went on to become a summer intern in our seed program in summer 2006, a teaching assistant in our Principles of Team Engineering course, and is currently an intern at SOTA Environmental Technologies.
What is the TIES Summer Leadership Scholarship/Internship?
Helping to grow tomorrow’s technology leaders is embedded into the mission of our Teams In Engineering Service (TIES) program, which reaches these goals by service-learning. Multidisciplinary teams of UCSD undergraduates work with community non-profit organizations as clients, and gain academic-year credit, for helping solve their client’s technology-based needs; a mutually beneficial circle of collaboration is formed. While our community clients are very pleased with the achievements of our student teams, the summer break of 3 months is a gap in progress, where project continuity is challenged. Consequently, to strengthen the circle, we have initiated a summer undergraduate intern program that aims both to further develop undergraduate leaders and provide needed continuity of service for the community clients. This summer component is essential towards guaranteeing success of the projects, strengthening the long-term relationships with our community partners, and creating technology leaders with strong social awareness.
Applications deadline has passed.
Application can be downloaded here
Applications were due by 5 pm, May 25, 2007 by submitting to Dr. Silvia Mah (samah@ucsd.edu).
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